Zuken Inc. (Headquarters: Yokohama, Japan; President and Representative Director: Jinya Katsube; hereinafter “Zuken”) today announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP).
TSMC collaborates with its OIP EDA Alliance partners to address growing design demands, accelerate adoption of latest process and packaging technologies, and enable customers to achieve their PPA and time-to market targets. By participating in this alliance, Zuken will further enhance its IC packaging and printed circuit board (PCB) design products with the capabilities essential to support multi-die and chiplet-based designs using TSMC’s industry-leading technologies.
“We are pleased to welcome Zuken to the OIP EDA Alliance,” said Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC. “The pursuit of higher performance and greater power efficiency continues to accelerate innovation in process and packaging technologies. By collaborating closely with EDA partners like Zuken, we enable customers to leverage TSMC’s advanced technologies to meet the demanding design targets of next-generation AI, HPC, and mobile applications.”
“By joining TSMC’s OIP EDA Alliance, Zuken will align its solutions with TSMC’s leading process and advanced packaging technologies. We are committed to helping our mutual customers seamlessly integrate semiconductor, package, and PCB design to meet today’s stringent system requirements,” said Ryosuke Takagi, Executive Officer and General Manager of the R&D Division at Zuken.